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LED灯珠结构全解析

LED灯珠主要由支架、银胶、晶片、金线、环氧树脂五种物料所组成。

 LED灯珠支架 

1.支架的作用:导电和支撑

2.支架的组成:支架由支架素材经过电镀而形成,由里到外是素材、铜、镍、铜、银这五层所组成。

3.支架的种类:带杯支架做聚光型,平头支架做大角度散光型。   

 LED灯珠银胶     

1.银胶的作用:固定晶片和导电。      

2.银胶的主要成份:银粉占75-80% 、EPOXY(环氧树脂)占10-15% 、添加剂占5-10% 。

3.银胶的使用:冷藏,使用前需解冻并充分搅拌均匀,因银胶放置长时间后,银粉会沉淀,如不搅拌均匀将会影响银胶的使用性能。

 LED灯珠晶片 

1.晶片的作用:晶片是 LED Lamp 的主要组成物料,是发光的半导体材料。

2.晶片的组成:晶片是采用磷化镓(GaP)  、 镓铝砷(GaAlAs)或砷化镓(GaAs)、氮化镓(GaN)等材料组成,其内部结构具有单向导电性。

3.晶片的结构:焊单线正极性(P/N结构)晶片,双线晶片。晶片的尺寸单位:mil,晶片的焊垫一般为金垫或铝垫。其焊垫形状有圆形、方形、十字形等。

4.晶片的发光颜色:晶片的发光颜色取决于波长,常见可见光的分类大致为:暗红色(700nm)、深红色(640-660nm)、红色(615-635nm)、琥珀色(600-610nm)、黄色(580-595nm)、黄绿色(565-575nm)、纯绿色(500-540nm)、蓝色(450-480nm)、紫色(380-430nm) 。公众号:深圳LED网
白光和粉红光是一种光的混合效果。最常见的是由蓝光+黄色荧光粉和蓝光+红色荧光粉混合而成。

5.晶片的主要技术参数:
    a.晶片的伏安特性图;
    b.正向电压(VF):施加在晶片两端,使晶片正向导通的电压。此电压与晶片本身和测试电流存在相应的关系。VF过大,会使晶片被击穿。
    c.正向电流(IF):晶片在施加一定电压后,所产生的正向导通电流。IF的大小,与正向电压的大小有关。晶片的工作电流在10-20mA左右。
    d.反向电压(VR):施加在晶片上的反向电压。  公众号:深圳LED网
    e.反向电流(IR):是指晶片在施加反向电压后,所产生的一个漏电流。此电流越小越好。因为电流大了容易造成晶片被反向击穿。
    f.亮度(IV):指光源的明亮程度。单位换算:1cd=1000mcd   
    g.波长:反映晶片的发光颜色。不同波长的晶片其发光颜色不同。单位:nm

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LED lamp beads are mainly composed of five materials: bracket, silver glue, chip, gold wire and epoxy resin.

 LED lamp bead bracket

1. The role of the bracket: conduction and support

2. The composition of the stent: the stent is formed by electroplating the stent material, and consists of five layers of material, copper, nickel, copper, and silver from the inside to the outside.

3. Types of brackets: the cup bracket is the condensing type, and the flat head bracket is the large-angle astigmatism type.

 LED lamp beads silver glue

1. The role of silver glue: fix the chip and conduct electricity.

2. The main components of silver glue: silver powder accounts for 75-80%, EPOXY (epoxy resin) accounts for 10-15%, and additives account for 5-10%.

3. Use of silver glue: refrigerate, thaw and stir well before use, because the silver powder will precipitate after the silver glue is left for a long time, if it is not stirred evenly, it will affect the performance of the silver glue.

 LED lamp chip

1. The function of the wafer: The wafer is the main component of the LED Lamp, and it is a light-emitting semiconductor material.

2. The composition of the wafer: The wafer is made of gallium phosphide (GaP), gallium aluminum arsenide (GaAlAs), gallium arsenide (GaAs), gallium nitride (GaN) and other materials, and its internal structure has unidirectional conductivity.

3. Chip structure: single wire positive polarity (P/N structure) chip, double wire chip. The size unit of the chip: mil. The bonding pads of the chip are generally gold pads or aluminum pads. The pad shapes are round, square, cross and so on.

4. The light-emitting color of the wafer: The light-emitting color of the wafer depends on the wavelength. The classification of common visible light is roughly: dark red (700nm), deep red (640-660nm), red (615-635nm), amber (600-610nm) , Yellow (580-595nm), yellow-green (565-575nm), pure green (500-540nm), blue (450-480nm), purple (380-430nm). Public number: Shenzhen LED Network
White light and pink light are a kind of mixed effect of light. The most common is a mixture of blue + yellow phosphor and blue + red phosphor.

5. The main technical parameters of the chip:
    a. The volt-ampere characteristic diagram of the chip;
    b. Forward voltage (VF): The voltage applied to both ends of the wafer to make the wafer forward conduction. This voltage has a corresponding relationship with the wafer itself and the test current. If VF is too large, the chip will be broken down.
    c. Forward current (IF): The forward conduction current generated by the chip after a certain voltage is applied. The magnitude of IF is related to the magnitude of the forward voltage. The working current of the chip is about 10-20mA.
    d. Reverse voltage (VR): The reverse voltage applied to the wafer. Public number: Shenzhen LED Network
    e. Reverse current (IR): refers to a leakage current generated by the chip after the reverse voltage is applied. The smaller the current, the better. Because the current is large, it is easy to cause the chip to be reversed breakdown.
    f. Brightness (IV): refers to the brightness of the light source. Unit conversion: 1cd=1000mcd
    g. Wavelength: reflects the luminous color of the wafer. Wafers of different wavelengths emit different colors. Unit: nm